This work studies the influence of temperature on performance and scalabilityof 3D Chip Multiprocessors (CMP) from Amdahl law perspective. We find that 3DCMP may reach its thermal limit before reaching its maximum power. We show thata high level of parallelism may lead to high peak temperatures even in smallscale 3D CMPs, thus limiting 3D CMP scalability and calling for different,in-memory computing architectures.
展开▼
